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Meyer Burger Awarded Two Contracts for its DS 261 Wire Saws

Contracts worth $17.5 million are from existing customers in the semiconductor industry.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Meyer Burger Technology Ltd announced the successful conclusion of repeat orders from two existing customers for its DS 261 wire saw equipment for slicing and wafering applications in the semiconductor industry.
 
In response to the strong growing global demand for semi-wafers, the customers, global manufacturers in the semiconductor industry, are expanding their production capacity. The strategic selection of Meyer Burger’s DS 261 cutting equipment is based on their excellent experience with Meyer Burger’s technology from previous projects.
 
The total contractual value of both orders is approximately CHF 17.5 million ($17.5 million). The orders comprise the installation, on-site training and service of the DS 261 wire saw equipment. Delivery of the equipment is scheduled to begin in the first half of 2019.

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